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Senior System Architect, High-Speed Interconnects
·Israel
On-siteFull-timeHardware EngineeringComputer Hardware Manufacturing
Lead the architectural definition of high-speed interconnect systems for next-gen AI platforms, including NVLink and InfiniBand fabrics. Drive evaluation of co-packaged optics, silicon photonics, and advanced form factors. Collaborate cross-functionally to optimize signal integrity from silicon to connector. 12+ years experience required.
Responsibilities
- Lead end-to-end definition of high-speed interconnect systems for next-gen AI platforms
- Evaluate and select pioneering technologies like Co-Packaged Optics and Silicon Photonics
- Collaborate with ASIC, Thermal, and PCB teams to optimize the silicon-to-connector signal path
- Represent the company in standards bodies to influence high-speed connector specifications
- Partner with vendors to develop custom mechanical and electrical designs
- Conduct trade-off analyses for interconnect media regarding reach, power, latency, and cost
Requirements
- Deep understanding of Channel Operating Margin (COM), BER, FEC, and crosstalk in 112G/224G PAM4 environments
- Expert knowledge of PCIe Gen 6/7, Ethernet 800G/1.6T
- Sophisticated knowledge of OSFP, QSFP-DD, SFP-DD form factors; experience with DAC, ACC, AOC architectures
- Familiarity with Silicon Photonics, CPO, and MPO/APC fiber architectures
- B.Sc./M.Sc. or PhD or equivalent experience in Electrical Engineering, Physics, or related field
- 12+ years in high-speed hardware design or system architecture, with proven track record of shipping high-volume data center products
- Ability to predict technology bottlenecks 3–5 years in advance
- Multi-functional influence to align Software, Hardware, and Thermal teams on architectural vision
- Exceptional ability to present complex trade-offs to executive leadership
Benefits
- Competitive salary
- Comprehensive benefits package