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Senior Package Engineer
·Israel
On-siteFull-timeHardware EngineeringComputer Hardware Manufacturing
Lead the development of microelectronics packaging for future networking products. Collaborate with vendors, investigate failures, and support production. Requires 8+ years of experience in complex process development and a degree in engineering.
Responsibilities
- Lead the development of groundbreaking microelectronics packaging for networking products
- Collaborate with world-leading vendors to develop highly ambitious packaging solutions
- Join and lead task forces to investigate and support production excursions, failure analysis, and reliability issues
- Conduct failure investigations and provide production support for high-volume products
Requirements
- MSc or equivalent experience in Mechanical Engineering, Materials Engineering, Chemical Engineering, or a related field
- At least 8 years of experience with the development of complex processes (e.g., warpage, heat, optics, adhesives)
- Experience co-working with subcontractors and vendors
- Vision and focus for projects and team
- Curious and creative problem-solving skills, organized and able to multitask
- Team-oriented with strong interpersonal skills (verbal and written)
- High awareness of quality, manufacturability, and project schedule
Nice to have
- Proven record in packaging development
- Background in semiconductor manufacturing processes and optical systems
Benefits
- Competitive salary
- Comprehensive benefits package