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Senior Thermal Engineer

Mobileye·Israel·en
On-siteFull-timeHardware EngineeringAutomotiveSemiconductors

Join an automotive technology engineering team developing thermal solutions for next-generation SoCs, ECUs, and high-performance compute platforms. Lead work from early architecture through qualification and production across sites in Haifa, Petah Tikva, and Jerusalem.

Responsibilities

  • Develop thermal architectures for next-generation SoCs and air- or liquid-cooled ECU platforms.
  • Define product and cooling requirements, including coolant temperature, flow rate, pressure drop, thermal interfaces, and thermal margins.
  • Perform CFD analysis and thermal assessment of SoC and package designs, including temperature distribution, heat spreading, material stack-ups, and thermal resistance.
  • Develop and evaluate air cooling, liquid cooling, heat pipe, and advanced heat-spreading solutions.
  • Support vehicle-level cooling architecture and ECU integration for autonomous driving and robotaxi platforms.
  • Correlate simulations with laboratory and product measurements, and drive thermal optimization and troubleshooting through qualification.
  • Collaborate with silicon architecture, packaging, hardware, mechanical, electrical, validation, suppliers, Tier-1 organizations, and OEM customers.

Requirements

  • M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
  • At least 5 years of relevant thermal engineering experience involving electronic systems, semiconductor packages, ECUs, or high-performance computing.
  • Strong expertise in heat transfer, fluid mechanics, thermal management, and CFD simulation.
  • Experience using thermal simulation tools such as Celsius EC, Icepak, FloTHERM, or equivalent.
  • Experience developing and validating air- or liquid-cooling solutions for high-power electronics through qualification, new product introduction, and mass production.
  • Ability to independently lead complex technical activities across multiple engineering disciplines.
  • Excellent technical communication skills in English.

Nice to have

  • Experience with semiconductor package thermal design and characterization.
  • Background in automotive ECUs, high-performance computing platforms, or automotive qualification.
  • Hands-on experience with heat pipes, vapor chambers, or cold plates.
  • Experience working with Tier-1 suppliers, OEMs, packaging houses, or thermal solution vendors.

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