Staff Signal Integrity Engineer
Lead signal integrity and power integrity engineering for advanced multi-die packages, high-speed interconnects, memory subsystems, and custom silicon products. The role is based in Israel, with work locations in Haifa or Tel Aviv.
Обязанности
- Lead end-to-end signal integrity definition, channel budgeting, and stackup optimization for complex 2.5D and 3D packages and high-density substrates.
- Architect and optimize multi-terabit Die-to-Die, PCIe, PAM4 SerDes, HBM, DDR5, and related memory interconnects.
- Build 3D full-wave electromagnetic models for package structures including micro-bumps, interposers, TSVs, and BGA transitions.
- Establish automated flows for statistical eye and BER margin analysis.
- Define high-frequency test vehicles, fixtures, and measurement methodologies.
- Perform VNA, TDR, and real-time oscilloscope characterization and correlate laboratory measurements with simulations.
- Collaborate with silicon design, package layout, board and system teams, foundries, and OSAT partners to resolve design trade-offs.
Требования
- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
- At least 10 years of experience in signal integrity, power integrity, or high-speed hardware packaging.
- Experience with electrical channel modeling, jitter budgeting, and return-loss or crosstalk optimization for high-speed serial or parallel interfaces.
- Experience using multi-port vector network analyzers, time-domain reflectometers, and high-bandwidth real-time oscilloscopes for simulation correlation.
Будет плюсом
- Master’s degree or PhD in Electrical Engineering, Computer Engineering, or Computer Science, preferably with a computer architecture focus.
- Experience leading SI/PI architecture for server-class CPUs, AI accelerators, or multi-chiplet modules.
- Experience developing automated electromagnetic extraction, layout parsing, and statistical eye/BER analysis pipelines using Python, MATLAB, or Tcl.
- Experience leading cross-functional teams, mentoring engineers, and managing technical roadmaps with OSATs, substrate manufacturers, and foundries.