Director of Hardware Reliability Engineering
Lead system-level reliability and failure analysis for networking hardware used in next-generation data centers. Manage multiple engineering teams, guide qualification and validation, and drive product stability, manufacturability, and long-term performance.
Responsibilities
- Lead end-to-end reliability and failure-analysis activities across the networking organization.
- Direct, coach, mentor, and develop multiple system-level engineering teams and managers.
- Partner with board-build, mechanical, thermal, PCB layout, and production teams to improve product quality.
- Lead investigations of complex and intermittent field failures and establish definitive root causes.
- Apply statistical tools and physics-of-failure models to predict product life and identify wear-out mechanisms.
- Drive Build for Reliability and Build for Manufacturing requirements into early hardware specifications.
- Establish a lessons-learned process that feeds failure-analysis findings into future hardware design rules.
- Define processes that improve qualification coverage and overall product quality.
Requirements
- B.Sc. or M.Sc. in Materials Science and Engineering.
- 15+ years of overall management experience with teams of 10 or more, including at least 8 years in management.
- Deep knowledge of physics of failure and reliability physics for semiconductors, PCB assemblies, and interconnects.
- Hands-on experience with cross-sectioning, SEM/EDX, CSAM, X-ray, and Dye & Pry failure-analysis methods.
- Proficiency in Weibull analysis, accelerated life testing, and MTBF modeling.
- Knowledge of JEDEC, IPC, and Telcordia qualification standards.
- Ability to coordinate testing across multiple programs and manage competing assignments.