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Senior Physical Design Technical Lead

Intel·ישראל·en
במקום העבודהמשרה מלאהHardware EngineeringSemiconductor Manufacturing

Lead backend physical design implementation for advanced wireless and VLSI products, improving design flows, automation, signoff methodologies, and PPA outcomes. This is an on-site role in Petah Tikva, Israel.

תחומי אחריות

  • Lead backend physical design implementation for complex VLSI chips.
  • Define and improve design implementation flows, automation, and signoff methodologies.
  • Optimize power, performance, and area using advanced techniques and tools.
  • Analyze and resolve issues involving place and route, timing, power, signal integrity, and manufacturability.
  • Collaborate with design teams on specification integration and optimization.
  • Mentor junior engineers and provide technical guidance.
  • Evaluate and integrate new EDA tools and technologies with vendors.
  • Track developments in VLSI physical design.

דרישות

  • Bachelor’s or master’s degree in electrical engineering or computer engineering.
  • At least 10 years of hands-on VLSI physical design experience, including work with advanced technology nodes.
  • Extensive knowledge of physical design flows, including floorplanning, placement, routing, and timing closure.
  • Proficiency with Synopsys EDA tools.
  • Knowledge of Python, Perl, or Tcl scripting.
  • Strong understanding of static timing analysis, IR-drop and electromigration analysis, DRC/LVS, ECO flows, and PPA optimization.
  • Experience managing and mentoring technical teams.
  • Strong problem-solving, communication, teamwork, and attention-to-detail skills.

יתרון

  • Cadence EDA tool experience

רלוונטיות

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משרות דומות

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