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Senior IC Package Design Engineer
במקום העבודהמשרה מלאהHardware EngineeringNetworking Equipment
Design and develop complex ASIC packages from early architecture and planning through implementation and tapeout. Collaborate with package layout, silicon, signal integrity, power integrity, and manufacturing teams to deliver high-speed, robust, and manufacturable solutions.
תחומי אחריות
- Lead package design planning, floorplanning, pinout optimization, stack-up definition, and high-speed routing support.
- Coordinate with signal integrity, power integrity, silicon floorplanning, layout, and manufacturing teams.
- Support package implementation and ensure physical layouts align with design intent.
- Conduct technical investigations, design reviews, and tradeoff discussions.
- Improve package design methodologies, flows, and best practices.
- Debug issues and support package bring-up activities.
דרישות
- Bachelor’s degree in Electrical Engineering or a related field.
- At least 5 years of experience in package, PCB, or high-speed design engineering.
- Strong understanding of high-speed signal design and power distribution networks.
- Familiarity with industry-standard EDA layout and design tools.
- Strong communication and cross-functional collaboration skills.
יתרון
- Master’s degree in Electrical Engineering.
- Experience with advanced packaging technologies, interposers, or multi-die systems.
- Knowledge of silicon floorplanning, signal integrity, and power integrity considerations.
- Experience leading design improvements and coordinating stakeholders throughout the design process.