Senior Hardware Engineering Manager, Co-Packaged Optics Switches
Lead a hardware engineering team developing high-performance co-packaged optics switches for next-generation data-center networking and AI infrastructure. This hands-on leadership role covers development from concept through mass production.
Обязанности
- Lead and develop a team of hardware engineers designing co-packaged optics switch systems from concept to mass production.
- Provide technical leadership across specification definition, electrical schematics, opto-mechanical design, component selection, layout, laboratory testing, production processes, qualification, microarchitecture, verification, characterization, design for testability, cost optimization, and reliability.
- Coordinate board design, assembly, mechanics, thermal, PCB layout, process, production engineering, software and firmware, procurement, and new product introduction activities.
- Plan team workloads across multiple concurrent development projects and allocate resources with the wider leadership team.
- Manage direct reports through goal setting, coaching, performance reviews, career planning, and compensation recommendations.
- Gather and prioritize requirements from marketing, software, systems engineering, and other internal stakeholders.
- Create project plans, estimate outcomes, schedule work, and drive timely execution for high-volume manufacturing.
Требования
- Bachelor’s or master’s degree in Electrical Engineering.
- At least 12 years of industry experience in board design architecture, development, and methodology.
- At least 6 years of technical design management experience.
- Experience leading multidisciplinary projects involving multilayer, high-density PCB design.
- Deep understanding of broadband, high-speed integrated circuits.
- Ability to evaluate power, performance, manufacturability, thermal, and cost trade-offs.
- Experience delivering complex designs under tight schedules through risk mitigation and detailed planning.
- Strong interpersonal and communication skills, including relationship building, prioritization, and cross-functional alignment.
Будет плюсом
- Experience designing data-center networking products for high-volume manufacturing.
- Experience with optoelectronics and optical communication systems.