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Junior R&D Hardware Engineer
Не указаноПолная занятостьCommunications EngineeringSemiconductor Manufacturing
Develop, characterize, and troubleshoot optical transceivers and high-speed communication modules from architecture through production readiness. The role involves electrical, RF, optical, thermal, and timing analysis in collaboration with international cross-functional teams.
Обязанности
- Perform electrical, optical, thermal, and timing measurements on optical transceivers and high-speed communication modules.
- Prepare compliance and characterization reports and support new product introduction from architecture through production readiness.
- Participate in design reviews, EVT/DVT activities, and resolution of design-for-manufacturability issues.
- Design and revise printed circuit board assemblies.
- Conduct RF simulations and analyze high-speed communication links.
- Troubleshoot electrical, RF, and optical issues through hands-on testing and root-cause analysis.
- Create and maintain schematics, drawings, bills of materials, engineering change orders, and other engineering documentation.
- Coordinate with program management, procurement, planning, manufacturing, suppliers, and other global teams to support builds.
- Follow engineering, quality, environmental, health, and safety processes.
Требования
- Bachelor’s degree in Electrical Engineering or a related field.
- At least two years of experience in electrical, RF, high-speed, or optical transceiver design.
- Knowledge of circuit theory, linear systems, feedback systems, integrated circuits, and high-speed RF fundamentals.
- Understanding of data-center and AI networking architectures, optical interconnects, link budgets, signal integrity, power, thermal management, reliability, and system performance.
- Familiarity with Ethernet, InfiniBand, PCIe, or comparable high-speed interconnect technologies.
- Hands-on measurement, problem-solving, root-cause analysis, electronic design, product development, ECAD, and system modeling experience.
- Professional fluency in written and spoken English.
- Ability to collaborate effectively in an international, cross-functional environment.
Будет плюсом
- Master’s or Ph.D. in Electrical Engineering, Electronics, Photonics, RF Engineering, or a related field.
- RF design and electromagnetic modeling experience with tools such as CST or HFSS.
- Knowledge of embedded and AI computing architectures, including GPUs, TPUs, HBM, NICs, DPUs, switching fabrics, and related interconnects.
- Experience designing or testing optical transceivers, optoelectronic modules, or high-speed communication systems.
- Exposure to manufacturing, design for manufacturability, supplier engagement, or new product introduction.