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Senior Power Delivery Engineer
Не указаноПолная занятостьElectrical DesignComputer HardwareArtificial Intelligence
Own power delivery architecture and design for high-power AI server platforms, working across board, server and rack levels with silicon, package, mechanical, thermal and systems teams.
Обязанности
- Architect and design board-, server- and rack-level power delivery systems for high-power subsystems.
- Define PDN topology, including VRMs, POLs, power routing and high-current interfaces.
- Select power components and establish derating, margin and reliability guidelines.
- Develop decoupling strategies across package and PCB layers to meet impedance and transient response targets.
- Analyze power integrity using AC/DC, target-impedance, transient and EMI/EMC methods; validate through modeling, simulation and lab measurements.
- Coordinate with mechanical and thermal teams on high-current routing, cooling and system constraints.
- Work with silicon and package teams on vertical PDN paths, interfaces, pin/bump maps and transient load profiles; advise silicon design on power integrity.
- Develop validation test plans for PDNs, transient loads, impedance measurements and system bring-up.
- Support failure analysis, root-cause investigations and corrective actions for system power issues.
Требования
- Bachelor’s or master’s degree in electrical engineering or a related field.
- At least 10 years of experience in high-power delivery design.
- Demonstrated experience designing high-current, low-voltage power delivery for SoCs.
- Expertise in power integrity, PDN modeling, VRM design, target impedance and transient response optimization.
- Proficiency with SPICE, PDN simulation tools such as Keysight, Cadence Sigrity/Clarity or Ansys SIwave, and measurement equipment including VNAs, oscilloscopes and electronic loads.
- Understanding of package-to-PCB PDN interactions.
Будет плюсом
- Familiarity with EMI/EMC mitigation in high-current environments.
- Experience with server-class PCB design, including stackup planning, high-current routing and decoupling strategies.
- Background in thermal-mechanical co-design for high-power modules.
- Knowledge of rack-level power architectures, ORv3/OCP standards, power shelves and busbar systems.