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Senior Thermal Engineer
В офисеПолная занятостьHardware EngineeringAutomotiveSemiconductors
Join an automotive technology engineering team developing thermal solutions for next-generation SoCs, ECUs, and high-performance compute platforms. Lead work from early architecture through qualification and production across sites in Haifa, Petah Tikva, and Jerusalem.
Обязанности
- Develop thermal architectures for next-generation SoCs and air- or liquid-cooled ECU platforms.
- Define product and cooling requirements, including coolant temperature, flow rate, pressure drop, thermal interfaces, and thermal margins.
- Perform CFD analysis and thermal assessment of SoC and package designs, including temperature distribution, heat spreading, material stack-ups, and thermal resistance.
- Develop and evaluate air cooling, liquid cooling, heat pipe, and advanced heat-spreading solutions.
- Support vehicle-level cooling architecture and ECU integration for autonomous driving and robotaxi platforms.
- Correlate simulations with laboratory and product measurements, and drive thermal optimization and troubleshooting through qualification.
- Collaborate with silicon architecture, packaging, hardware, mechanical, electrical, validation, suppliers, Tier-1 organizations, and OEM customers.
Требования
- M.Sc. in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, or a related field.
- At least 5 years of relevant thermal engineering experience involving electronic systems, semiconductor packages, ECUs, or high-performance computing.
- Strong expertise in heat transfer, fluid mechanics, thermal management, and CFD simulation.
- Experience using thermal simulation tools such as Celsius EC, Icepak, FloTHERM, or equivalent.
- Experience developing and validating air- or liquid-cooling solutions for high-power electronics through qualification, new product introduction, and mass production.
- Ability to independently lead complex technical activities across multiple engineering disciplines.
- Excellent technical communication skills in English.
Будет плюсом
- Experience with semiconductor package thermal design and characterization.
- Background in automotive ECUs, high-performance computing platforms, or automotive qualification.
- Hands-on experience with heat pipes, vapor chambers, or cold plates.
- Experience working with Tier-1 suppliers, OEMs, packaging houses, or thermal solution vendors.