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Senior Physical Design Technical Lead
В офисеПолная занятостьHardware EngineeringSemiconductor Manufacturing
Lead backend physical design implementation for advanced wireless and VLSI products, improving design flows, automation, signoff methodologies, and PPA outcomes. This is an on-site role in Petah Tikva, Israel.
Обязанности
- Lead backend physical design implementation for complex VLSI chips.
- Define and improve design implementation flows, automation, and signoff methodologies.
- Optimize power, performance, and area using advanced techniques and tools.
- Analyze and resolve issues involving place and route, timing, power, signal integrity, and manufacturability.
- Collaborate with design teams on specification integration and optimization.
- Mentor junior engineers and provide technical guidance.
- Evaluate and integrate new EDA tools and technologies with vendors.
- Track developments in VLSI physical design.
Требования
- Bachelor’s or master’s degree in electrical engineering or computer engineering.
- At least 10 years of hands-on VLSI physical design experience, including work with advanced technology nodes.
- Extensive knowledge of physical design flows, including floorplanning, placement, routing, and timing closure.
- Proficiency with Synopsys EDA tools.
- Knowledge of Python, Perl, or Tcl scripting.
- Strong understanding of static timing analysis, IR-drop and electromigration analysis, DRC/LVS, ECO flows, and PPA optimization.
- Experience managing and mentoring technical teams.
- Strong problem-solving, communication, teamwork, and attention-to-detail skills.
Будет плюсом
- Cadence EDA tool experience