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Physical Design Lead

Google·Tel Aviv, Израиль·en
В офисеПолная занятостьHardware EngineeringSemiconductorsCloud Computing

Lead physical design and silicon delivery for complex SoCs, including AI hardware. The role covers design methodology, implementation strategy, team execution, and tape-out.

Обязанности

  • Lead physical design of complex SoCs through tape-out, working with multiple team members.
  • Evaluate and develop physical design methodologies and select SoC implementation flows.
  • Partner with architects and logic designers on feasibility studies, timing, power, and area goals, and RTL/design trade-offs.
  • Participate in design reviews, track issue resolution, and contribute to technical and schedule trade-off discussions.
  • Plan project execution and manage team efforts from concept through volume silicon.
  • Define physical design strategies to meet quality and schedule goals.

Требования

  • Bachelor’s degree in Electrical Engineering or Computer Science, or equivalent practical experience.
  • Experience in silicon implementation and chip integration.
  • Experience working in ASIC development teams.
  • Experience managing physical design teams delivering digital designs to silicon.

Будет плюсом

  • Experience with design-parameter extraction and trend analysis.
  • Broad engineering experience across physical design, top-level implementation, and GDS tape-out.
  • Experience with floor planning, block integration, static timing analysis, and sign-off.
  • Knowledge of circuit design, device physics, deep sub-micron technology, and high-complexity silicon delivery.
  • Ability to lead cross-functional teams.

Соответствие

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