Physical Design Lead
Lead physical design of complex systems-on-chip from early planning through tape-out and volume production. Set implementation strategies and methodologies, guide cross-functional engineering work, and drive design closure against quality and schedule goals.
Обязанности
- Lead physical design of complex SoCs through tape-out with multiple team members.
- Evaluate physical design methodologies and select the SoC implementation flow.
- Partner with architects and logic designers on feasibility studies, timing, power, and area goals, and RTL/design trade-offs.
- Participate in design reviews, track issue resolution, and contribute to technical and schedule trade-offs.
- Plan project execution and manage team efforts from concept through working silicon in volume.
- Define physical design strategies and tactics to meet quality and schedule goals.
Требования
- Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
- Experience in silicon implementation and chip integration.
- Experience working in ASIC development teams.
- Experience managing physical design teams responsible for digital designs and silicon delivery.
Будет плюсом
- Experience extracting design parameters and analyzing trends.
- Broad engineering experience in physical design, top-level implementation, and GDS tape-out.
- Experience with floor planning, block integration, static timing analysis, and sign-off.
- Understanding of circuit design, device physics, and deep sub-micron technology.
- Knowledge of delivering complex silicon across technology nodes.
- Ability to lead cross-functional teams.