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Junior Package Engineer

NVIDIA·Израиль·
В офисеПолная занятостьHardware EngineeringElectronics Manufacturing

Join a semiconductor engineering team developing advanced IC substrates and ASIC packages for networking products. The role covers packaging design, manufacturability, reliability, production quality, and supplier collaboration in Israel.

Обязанности

  • Lead development of advanced microelectronics packaging and IC substrates
  • Collaborate with signal integrity, layout, ASIC design, program, and supplier teams
  • Plan schedules and resolve packaging, manufacturing, cost, and electrical design issues
  • Evaluate products for reliability and performance
  • Review manufacturability readiness at development milestones
  • Lead investigations of production excursions, failure analysis, and reliability issues
  • Establish quality standards and monitor substrate and assembly production KPIs
  • Define and monitor yield improvement plans with cross-functional teams
  • Lead process-change reviews and present data at change control board meetings
  • Coordinate technical reviews of product changes across the supply chain

Требования

  • BSc or equivalent degree in Mechanical Engineering, Materials Engineering, or a related field, or equivalent experience
  • At least 2 years of relevant experience in semiconductor packaging, development, or manufacturing
  • Basic 2D and 3D design skills using tools such as ArtiosCAD, NX, SolidWorks, or Creo
  • Experience with design for manufacturability, tooling design, manufacturing processes, material properties, and metrology tools
  • Strong awareness of quality, robustness, and manufacturability
  • Ability to lead cross-company projects involving distributed, cross-functional teams
  • Self-directed, organized, collaborative, and proactive problem-solving approach

Будет плюсом

  • Hands-on FEA mechanical simulation experience
  • Team, group, or project management experience
  • Experience with manufacturing environments and statistical tools
  • Background in semiconductor manufacturing processes

Условия и преимущества

  • Competitive salary
  • Comprehensive benefits package
  • Equal-opportunity workplace with reasonable accommodations available

Соответствие

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