A
IC Package Design Lead
·Israel
On-siteFull-timeSemiconductor Manufacturing
Strategic technical leadership role responsible for end-to-end IC package design of advanced semiconductor products used in AI and cloud environments. Drive package architecture, signal integrity, power integrity, and manufacturing readiness, collaborating with silicon design and OSAT partners.
Responsibilities
- Own end-to-end IC package design from feasibility through high-volume manufacturing.
- Define package architecture and technology selection, including advanced substrates and chiplet integration.
- Lead signal integrity, power integrity, and thermal analysis at the package level for high-speed, high-power devices.
- Drive package layout, substrate routing, bump maps, stack-ups, and material selection.
- Collaborate with silicon, system, and reliability teams to optimize product performance.
- Interface with OSATs, substrate vendors, and manufacturing partners to ensure DFM and cost targets.
- Manage package risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
- Support NPI, qualification, and vendor audits.
Requirements
- 10+ years of hands-on IC package design experience for high-performance semiconductor products.
- Expert proficiency in package design tools such as Cadence APD or SiP.
- Strong experience with complex packages (BGA, FCBGA, FCCSP) and substrate technology.
- Deep understanding of signal, power, and thermal integrity at the package level.
- Proven manufacturing and release experience with DRC/LVS/DFM and OSAT engagement.
Nice to have
- Experience with AI, networking, PCIe, CXL, or high-speed data center interfaces.
- Familiarity with package reliability standards (JEDEC, IPC, etc.).
- Experience with chiplet-based architectures and heterogeneous integration.
- Prior technical leadership on high-volume products.