A
Package Substrate Layout Engineer
·Israel
On-siteFull-timeHardware EngineeringSemiconductors
Join a chip design team to lead complex PCB and package substrate layout, ensuring signal and power integrity, applying design for manufacturability, and driving continuous improvement in package design processes.
Responsibilities
- Design and layout of large, complex PCBs.
- Design and layout of package substrates.
- Apply package substrate technologies and layout design rules.
- Ensure signal and power integrity in designs.
- Conduct layout test studies for die bump-out structures and package substrate breakout.
- Conduct layout test studies for package pin-out arrangements and PCB board implementation.
- Drive continuous improvement initiatives to enhance quality, cost, and schedule.
Requirements
- Bachelor's degree in electrical engineering or equivalent.
- 7+ years of professional PCB layout design experience.
- Expertise in substrate layout design and high-density interconnect (HDI) technologies.
- Advanced proficiency with industry-standard Cadence CAD tools.
- Experience with PCB manufacturing processes and design for manufacturability (DFM).
Nice to have
- Strong background in PCB layout.
- Experience with advanced packaging technologies (BGA, flip-chip).
- Knowledge of controlled impedance design.
- Familiarity with high-frequency/RF layout.