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Embedded Firmware Engineer – High Speed DSP
·Israel
On-siteFull-timeHardware EngineeringArtificial IntelligenceCloud ComputingSemiconductors
Lead firmware development for high-speed physical-layer communication silicon, focusing on digital signal processing, real-time control, and hardware-software co-design for AI/ML acceleration.
Responsibilities
- Define long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces.
- Architect advanced monitoring systems for real-time link health and bit error rate tracking.
- Design and implement bare-metal or RTOS firmware for high-speed transceivers and adaptive loops.
- Collaborate with TPU Systems, Networking Software, and HPC teams to integrate silicon firmware with cluster management.
- Identify and mitigate hardware-software interface bottlenecks affecting AI infrastructure performance.
Requirements
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or related technical field.
- 10 years of experience in embedded systems, firmware, communication systems, or DSP development.
- Experience developing embedded software (C/C++) for high-speed physical-layer interfaces, digital transceivers, or communication subsystems.
Nice to have
- Master's or PhD in Electrical Engineering, Computer Engineering, or related field.
- Expertise in Forward Error Correction algorithms and advanced modulation schemes.
- Track record defining firmware framework specifications, register maps, and silicon lifecycle telemetry.
- Background in wireless communications with knowledge of channel modeling, noise mitigation, and digital transceiver architectures.