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Senior Hardware Engineering Lead, Interconnect Systems

NVIDIA·ישראל·en
לא צויןמשרה מלאהHardware EngineeringComputer Hardware

Lead end-to-end technical execution for advanced interconnect test hardware, from requirements and design through validation and high-volume manufacturing. Coordinate multidisciplinary teams while contributing hands-on to characterization, debug, and automation.

תחומי אחריות

  • Lead interconnect hardware programs through requirements, architecture, design, bring-up, characterization, qualification, and production release.
  • Coordinate engineering workstreams, integration plans, priorities, risks, and dependencies across disciplines.
  • Consolidate stakeholder requirements into program plans and coordinate resources with engineering management.
  • Set validation and test coverage strategies; develop characterization plans, test methods, automation, and data analysis pipelines.
  • Perform electrical and optical debug and failure analysis, and lead root-cause investigations across hardware and firmware domains.
  • Develop Python tools for test automation, data collection, hardware control, and production optimization; define electrical specifications and DFM/DFT guidelines.
  • Partner with manufacturing teams to improve test coverage, yield, production test time, and cost.
  • Review designs, mentor engineers, and align multidisciplinary teams.

דרישות

  • BSc or MSc in Electrical Engineering, Electro-Optics, Applied Physics, a related field, or equivalent experience.
  • At least 12 years in hardware system engineering, characterization, or product engineering for electro-optical or high-speed communication products.
  • At least 5 years as a technical lead on multidisciplinary projects.
  • Experience guiding complex hardware programs from concept through mass production.
  • Hands-on experience with hardware design, lab bring-up, characterization, debugging, and electrical specification review.
  • Proficiency in Python, data analysis, test automation, and hardware interfaces such as I2C, SPI, and JTAG.
  • Ability to influence stakeholders and coordinate global engineering teams.

יתרון

  • Experience integrating Co-Packaged Optics systems into production.
  • Silicon photonics characterization experience, including lasers, modulators, detectors, or waveguides.
  • Familiarity with opto-mechanical design, DFM/DFT/DOE, and qualification testing.
  • Experience mentoring and developing teams and working with overseas manufacturing partners.

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