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Mechanical Engineering Manager, Thermal Systems

NVIDIA·Israel·
PresencialTiempo completoEngineering ManagementElectronics Manufacturing

Lead three multidisciplinary engineering teams developing mechanical, thermal, materials, and manufacturing solutions for high-power communication systems. Drive innovation from concept through mass production across chip-, component-, and rack-level designs.

Responsabilidades

  • Manage and lead three teams of more than 15 engineers across mechanical analysis, mechanical design, and materials engineering
  • Direct multidisciplinary research and development spanning mechanical design, thermal solutions, materials, soldering, joining technologies, and manufacturing processes
  • Lead mechanical analysis activities covering chip- to rack-level structural simulations
  • Support advanced liquid-cooled and air-cooled thermal solutions for next-generation products
  • Develop scalable, practical mechanical and thermal solutions for increasing power density
  • Guide engineering work from concept development through mass production

Requisitos

  • Master’s degree in Mechanical Engineering or an equivalent field
  • At least 8 years of overall engineering experience
  • At least 4 years of leadership experience managing thermal and mechanical development teams
  • Strong experience with mechanical and thermal analysis methodologies
  • Experience developing advanced thermal solutions, including liquid cooling, from concept through mass production
  • Strong understanding of thermo-mechanical challenges in high-power electronic systems
  • Experience working across chip-, component-, and system-level physical scales
  • Ability to lead multidisciplinary engineering activities and drive execution
  • Strong communication and cross-functional collaboration skills

Se valora

  • Experience addressing liquid-cooling scaling challenges
  • Expertise in advanced thermal interface materials and materials development
  • Experience enabling new technologies while maintaining manufacturability
  • Chip-to-rack system-level engineering perspective

Compatibilidad

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